What we do
The European Scientific Association for material FORMing -ESAFORM- is a non-profit scientific association. It was founded in January 1997 with the aim to propagate interest for all types of materials and all topics connected to Material Forming.
Next Conference
The 28th International ESAFORM Conference on Material Forming (ESAFORM 2025) will be jointly hosted by Prof Pierpaolo Carlone (University of Salerno) and Profs Domenico Umbrello & Luigino Filice (University of Calabria). It will be held in Paestum (Italy), at Hotel Ariston Paestum between 6-9th May 2025.
Material Forming
Within the association, forming has an open definition and includes any process that changes a materials’ shape.
International
ESAFORM in the recent years has established protocols of cooperation with national and international associations related to Material Forming.
Scientific Committee
The Scientific Committee safeguards the scientific quality of the ESAFORM conferences.
Prizes and Awards
ESAFORM offers a wide range of prizes awarding its members with great contribution to the field for researchers, industrial relevant doctors, and doctoral students.
Board of Directors
The Board of Directors is responsible for leading the association and is partly renewed every other year.
Publications
In cooperation with Springer, Esaform launched the International Journal of Material Forming in 2007 and the ESAFORM Book series in Material Forming in 2014.
ESAFORM Grants
ESAFORM offers a wide range of supporting grants for its members ranging from financial support in writing EU proposals over traveling of young researchers to workshop funding and support in the execution of benchmarks.
LATEST NEWS
Our objectives
We connect researchers in academic and industrial research laboratories.
We stimulate applied research and spread scientific information on material forming. We promote the interests of the material forming research community.
Membership
Participation in the annual conference includes a one-year membership. A direct application for membership, without conference participation, can be submitted here.